Semicon China: AI, advanced packaging set to drive country’s chip industry growth
China on track to account for nearly half of world wafer capacity in two years, organiser of world’s largest chip industry trade show says
Agentic artificial intelligence and advanced packaging technology will be key growth drivers for China’s chip industry in coming years, as the country is expected to increase its share of chipmaking capacity to nearly half of the world’s total by 2028.
That would mark a rapid increase from 32 per cent in 2025, according to Lily Feng, president of SEMI China, the Chinese branch of chip industry association SEMI and the organiser of the event.
The annual trade show, in Shanghai from Wednesday to Friday, expects to welcome more than 180,000 attendees this year, making it the world’s largest professional semiconductor expo, Feng said.
A key factor expected to drive growth in China’s chipmaking capacity will be the adoption of AI agents, a trend highlighted by a few speakers during the opening session of the event on Wednesday.