customContents

entityId

entityUuid

articlePageQuery

filter

article

articleBaseAdvertisingInfoArticle

articleListArticle

articleSeoArticle

helpersCheckIsPostiesArticle

hooksArticleAcknowledgementGateOverlayArticle

hooksTrackPageViewArticle

hooksContentInterestArticle

articleLinkingDataContent

articleSchemaContent

liveArticle

advertZone

sentiment

contentLock

topics

types

sections

moreOnThisArticles

urlAlias

commentCount

sponsorType

authorLocations

authors

paywallTypes

corrections

displaySlideShow

multimediaEmbed

printHeadline

seriesContainer

socialHeadline

headline

flag

firstTopic

glossary

flattenTypeIds

publishedDate

additionalInfoBoxes

images

image

relatedLinks

relatedNewsletters

__typename

createdDate

sponsor

factSheets

series

summary

updatedDate

knowledgeQuestion

disableOffPlatformContent

published

subHeadline

body

keywords

copyrighted

customTimezone

liveContents

Zhang Tong

Chinese scientists have produced an ultra-thin semiconductor material in a development that could lead to the creation of faster and more energy-efficient microchips.
A team led by Liu Kaihui of Peking University, Liu Can of Renmin University, and Zhang Guangyu of the Institute of Physics at the Chinese Academy of Sciences developed a fabrication method to produce a semiconductor material just 0.7 nanometres thick.
The researchers’ findings, which were published in the peer-reviewed journal Science on July 5, address a key barrier to reducing the size of traditional silicon-based chips – as devices shrink, silicon chips run into physical limits that affect their performance.
The scientists explored two-dimensional (2D) transition-metal dichalcogenides (TMDs) as an alternative to silicon, with a thickness of just 0.7 nanometres compared to silicon’s typical 5-10 nanometres.
TMDs also consume less power and have superior electron transport properties, making them ideal for the ultra-scaled down transistors that will be a feature of next-generation electronic and photonic chips.
However, producing TMDs has been challenging – until now. According to the paper, the technique developed by the scientists allows them to quickly produce high-quality 2D crystals in seven formulations, making mass production feasible.
The traditional fabrication process, which involves layer-by-layer assembly of atoms on a substrate – like building a wall with bricks – often results in crystals with insufficient purity, Liu Kaihui told state news agency Xinhua.
“This is due to uncontrollable atomic arrangements in crystal growth and the accumulation of impurities and defects,” he said.
The team arranged the first layer of atoms on the substrate as if they were following the traditional process. However, subsequent atoms were added between the substrate and the first crystal layer, pushing upwards like bamboo shoots to form new layers.
The “grow at interface” method ensures that each crystal layer’s structure is determined by the underlying substrate, which also effectively prevents the accumulation of defects and improves structural controllability.


A statement on Peking University’s website said the technique demonstrated in the study achieved a crystal layer formation rate of 50 layers per minute, with a maximum of 15,000 layers.
“Each layer’s atomic arrangement is perfectly parallel and precisely controlled,” the university said.
The team’s high-quality 2D crystals included molybdenum disulfide, molybdenum diselenide, tungsten disulfide, tungsten diselenide, niobium disulfide, niobium diselenide, and molybdenum sulfoselenide.
These materials met international standards for integrated circuit materials, including the International Roadmap for Devices and Systems’ electron mobility target and frequency conversion capabilities, the researchers said.
“These 2D crystals, when used as materials for transistors in integrated circuits, can significantly enhance chip integration. On a chip the size of a fingernail, the density of transistors can be substantially increased, thus boosting computing power,” Liu said.


Who are the China-linked scientists under US investigation? A growing list

China’s hypersonic missiles can be made from steel, scientists say

How US-China science pact’s fate could shake global R&D landscape

How Chinese engineers helped build the US semiconductor empire: a timeline

Science

Could this way of making ultra-thin semiconductors lead to faster microchips?

A team of researchers in China say they have found a way to make computing chips smaller and more powerful than silicon-based semiconductors. Photo: Shutterstock

China’s ‘rising star’ in chip design software cuts up to half its workforce amid market headwinds

The reliance on imported EDA software is one of China’s biggest vulnerabilities in the chip value chain. Photo: Shutterstock Images

Wang Libin, the founder X-Epic. Photo: Handout

Semiconductors are seen on a printed circuit board in this illustration picture taken February 17, 2023. Photo: Reuters

CrowdStrike-Microsoft outage: Chinese cybersecurity firms take victory lap

The CrowdStrike offices in Sunnyvale, California, on July 19, 2024. Photo: Bloomberg

Visitors tour the Chinese internet security firm Qihoo 360 booth at the World 5G Convention in Beijing on November 21, 2019. Photo: Xinhua

RNA could be used for safer and more effective gene therapies, Chinese study finds

The Chinese team used RNA, or ribonucleic acid, to precisely gene-edit mammalian cells. Photo: Getty Images/Science Photo Library RF

Chinese team’s solar-powered drone is lighter than paper plane, offers sustained flight

The ultralight micro aerial vehicle, dubbed the CoulombFly, is the product of six years of research. Photo:
Handout

Its creators say the CoulombFly was able to maintain sustained flight in an hour-long endurance test without any drop in performance. Photo: Handout

Chinese scientists propose information superhighway between Earth and the moon

Chinese scientists are working on a proposed communication network to make travel between Earth and the moon easier. Photo: Shutterstock

The three stages of developing cislunar infrastructure proposed by Chinese researchers. Photo: Handout

News

China

Research by Chinese team addresses key barrier to reducing the size of traditional silicon-based chips


Research by Chinese team addresses key barrier to reducing the size of traditional silicon-based chips.
